Blog Details

What is MIP+GOB Technology?

MIP+GOB is not a single technology, but rather a powerful combination of two advanced LED packaging and protection methods applied to a display module. It represents a high-reliability solution.

• MIP (Micro LED in Package): This is the internal packaging technology. Tiny Micro LED chips are first individually packaged into miniature, standardized "sub-units" before being mounted onto the circuit board. This improves the inherent consistency and reliability of the LEDs themselves.

• GOB (Glue on Board): This is the external protection technology. After the MIP packages are mounted, a transparent, protective epoxy resin is applied over the entire surface of the module, encapsulating the LEDs and circuitry.

In simple terms: MIP makes the core pixels better and more uniform, while GOB adds a tough, protective "shield" over them.

Key Advantages of MIP+GOB

The combination of these two technologies creates significant synergies, offering advantages that neither technology can provide alone:

1. Ultra-High Reliability & Durability:

   • The GOB layer provides excellent protection against physical impact (scratches, bumps), moisture, and dust. This makes the screen highly resistant to damage during installation, cleaning, and operation.

2. Superior Image Quality:

   • No "Caterpillar Effect": The GOB encapsulation eliminates the gaps between pixels, completely solving the common SMD issue of a whole column of LEDs failing (which looks like a caterpillar).

   • Enhanced Surface Flatness: The resin creates a perfectly smooth, seamless surface that reduces or eliminates moiré patterns when the screen is filmed by a camera—a critical advantage for virtual production.

   • Excellent Uniformity: MIP technology ensures high brightness and color consistency across the entire display from the start.

3. Simplified Maintenance & "Calibration-Free" Operation:

   • The robust protection drastically reduces the chance of dead pixels. Furthermore, the high inherent uniformity of MIP means the screen requires less frequent or even no software calibration to maintain a uniform appearance, saving time and cost.

4. Great Environmental Resistance:

   • This combination is ideal for challenging environments, as it is highly resistant to humidity, temperature variations, and even corrosion.

Where is it used? (Applications)

MIP+GOB technology is targeted at high-end applications where reliability, image consistency, and minimal downtime are critical:

• Virtual Production & Broadcast Studios: This is a perfect application. The seamless surface prevents camera moiré, and the durability withstands the busy studio environment.

• High-End Control & Command Centers: For 24/7 operation in sectors like security, transportation, and utilities, where screen failure is not an option.

• Premium Corporate Boardrooms & Experience Centers: Where a flawless, professional image and low maintenance are required.

• Harsh or Public Environments: Such as industrial settings or high-traffic public spaces like airports, where the screen needs to be tough.

Summary

MIP+GOB technology combines the pixel-level consistency of MIP packaging with the board-level protection of GOB encapsulation. The result is a display module that is extremely durable, delivers a seamless image, and requires minimal maintenance, making it a premium solution for mission-critical and high-end visual applications.